AMD Instinct MI355X
Dem still dey call am amd instinct mi355x, instinct mi355x
AMD Instinct MI355X na CDNA 4 datacenter compute accelerator with 288 GB of HBM3E memory, 256 compute units and OAM module form factor.
Wetin you need know
AMD Instinct MI355X na CDNA 4 datacenter compute accelerator with 288 GB of HBM3E memory, 256 compute units and OAM module form factor.
Reference specifications wey dem record no be tested performance or operating-system compatibility verdict. Verify di exact model and platform wit di manufacturer.
Model identity and limitations
AMD Instinct MI355X target GPU compute inside supported datacenter systems. AMD list di MI355X as OAM module for servers. Use di exact server configuration to establish cooling, power provisioning, supported host software and available accelerator partitions. Peak bandwidth and board-power specifications no dey measure complete application or server.
Specifications
Manufacturer specification reference
Selected model-specific fields wey dem check against AMD on October 29, 2026. Bandwidth na manufacturer peak specification, no be measured application performance. Power labels follow di manufacturer and dem no dey interchangeable with complete-system consumption.
| GPU architecture | CDNA 4 |
|---|---|
| Module form factor | OAM (OCP Accelerator Module) |
| Compute units | 256 |
| Stream processors | 16,384 |
| Memory capacity and type | 288 GB HBM3E per accelerator |
| Memory bandwidth | 8 TB/s peak |
| Manufacturer typical board power (TBP) | 1400 W |
Check di complete server platform
Confirm di server model, module identity, firmware and cooling configuration with di system vendor before you buy parts or change software. OAM module need compatible accelerator baseboard and server integration; host-interface specification alone no dey establish physical compatibility.
AMD list di MI355X as OAM module for servers. Use di exact server configuration to establish cooling, power provisioning, supported host software and available accelerator partitions. Peak bandwidth and board-power specifications no dey measure complete application or server.
Troubleshoot with di supported software stack
Record di server firmware, operating system, ROCm version, reported device identities and exact error before you make changes. Compare dat combination with AMD and di server vendor support documentation. Separate reported partitions or compute dies from physical accelerator modules.
Run di vendor documented acceptance checks inside maintenance window. Save di previous supported driver/runtime configuration and recovery procedure before you upgrade. If new runtime cause regression, restore di previously supported stack using di system vendor documented method; avoid to delete kernel or driver files by hand.
Sources and verification
Imported reference. Source-specific checks dey beside di supported fields and citations. How we dey do research.
- AMD: MI355X manufacturer specifications · Dey support model identity, compute units, stream processors, memory, bandwidth, OAM form and di stated power metric. Dem check am October 29, 2026.
- AMD: MI355X platform and software context · Dey support platform/partition context; check di documented release and exact server configuration.
- AMD ROCm: supported hardware and software compatibility · Check di chosen ROCm release, supported operating system and exact accelerator before deployment; compatibility dey change by release.
- Feex Hardware Database · Specification source wey dem use for dis sheet. CC BY 4.0.
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