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AMD Instinct MI250X

Datacenter GPU acceleratorAMD

Dem still dey call am amd instinct mi250x, instinct mi250x

AMDDatacenter GPU accelerator

AMD Instinct MI250X na CDNA 2 datacenter compute accelerator with 128 GB of HBM2e memory per OAM module and 220 compute units.

Wetin you need know

AMD Instinct MI250X na CDNA 2 datacenter compute accelerator with 128 GB of HBM2e memory per OAM module and 220 compute units.

Reference specifications wey dem record no be tested performance or operating-system compatibility verdict. Verify di exact model and platform wit di manufacturer.

Model identity and limitations

AMD Instinct MI250X target GPU compute inside supported datacenter systems. Di MI250X module contain two graphics compute dies. AMD document say ROCm dey expose di dies separately, with 64 GB of HBM2e per die. Separate per-die reports from di complete 128 GB module wen you dey diagnose visible device and memory counts.

Specifications

Manufacturer specification reference

Selected model-specific fields wey dem check against AMD on October 29, 2026. Bandwidth na manufacturer peak specification, no be measured application performance. Power labels follow di manufacturer and dem no dey interchangeable with complete-system consumption.

Manufacturer specification reference
GPU architecture CDNA 2
Module form factor OAM (OCP Accelerator Module)
Compute units 220
Stream processors 14,080
Memory capacity and type 128 GB HBM2e per OAM module
Memory bandwidth Reach up to 3.2 TB/s
Manufacturer TDP configurations 500 W and 560 W; e depend on platform and cooling

Check di complete server platform

Confirm di server model, module identity, firmware and cooling configuration with di system vendor before you buy parts or change software. OAM module need compatible accelerator baseboard and server integration; host-interface specification alone no dey establish physical compatibility.

Di MI250X module contain two graphics compute dies. AMD document say ROCm dey expose di dies separately, with 64 GB of HBM2e per die. Separate per-die reports from di complete 128 GB module wen you dey diagnose visible device and memory counts.

Troubleshoot with di supported software stack

Record di server firmware, operating system, ROCm version, reported device identities and exact error before you make changes. Compare dat combination with AMD and di server vendor support documentation. Separate reported partitions or compute dies from physical accelerator modules.

Run di vendor documented acceptance checks inside maintenance window. Save di previous supported driver/runtime configuration and recovery procedure before you upgrade. If new runtime cause regression, restore di previously supported stack using di system vendor documented method; avoid to delete kernel or driver files by hand.

Sources and verification

Imported reference. Source-specific checks dey beside di supported fields and citations. How we dey do research.

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